Xbox Series X / S
Nintendo Switch
PlayStation 5
PlayStation 4
On the Go
Other
Original chips improve the performance of computer
Selected original chips, strict inspection process, 8-layer PCB board, stable performance.
Aluminum alloy vest for effective heat dissipation
Aluminum alloy vest, strong heat dissipation effect, low working temperature, more stable operation
Gold-plated craft gold finger
Gold plating process, stronger conductivity and corrosion resistance
Features | |
---|---|
Lead plating | Gold |
Cooling type | Heatsink |
Memory voltage | 1.35 V |
Memory channels | Single-channel |
CAS latency | 16 |
ECC | No |
Memory form factor | 288-pin DIMM |
Component for | PC |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Buffered memory type | Unregistered (unbuffered) |
Operational conditions | |
---|---|
Storage temperature (T-T) | -55 - 100 °C |
Operating temperature (T-T) | 0 - 85 °C |
Sustainability | |
---|---|
Doesn't contain | Halogen |
Sustainability compliance | Yes |
Sustainability certificates | RoHS |
Weight & dimensions | |
---|---|
Height | 37.5 mm |
Depth | 6.1 mm |
Width | 137.5 mm |